1712241013
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-1 with Outer Down/Up Light Pipes, 40 Circuits
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-1 with Outer Down/Up Light Pipes, 40 Circuits
| 深圳仓库 | 中山仓库 | 可用库存 | 起订参考 | 标准包装（按倍数购） | 交期 |
|---|---|---|---|---|---|
| 0Pcs | 0Pcs | 0 | 0 | 0 | 无货 · 货期请询价 |
- 品类
- Products / Connectors / High-Speed I/O Products / High-Speed I/O Connectors
- 系列
- zSFP+ Stacked Ganged Assemblies
- 间距
- 0.80mm
- Pin
- 40
- 公母
- Female
- 额定电流
- 0.5A
- 包装形态
- Tray
- 原厂状态
- Active
库存明细
暂无可用库存
| 数量 ≥ | 单价（未税） | 含税约（13%） |
|---|---|---|
| 1 | ¥0.00 | ¥0.00 |
含税价为未税单价 × 1.13 的约估值，最终以下单支付单金额为准。
¥0.00未税/pc
包装待确认 · 走询价
产物环境合规7 项
| GADSL/IMDS | Compliant with Exemption 44; 34; 33 |
| China RoHS | Green Image per SJ/T 11365-2006 |
| EU ELV | Not Relevant |
| EU RoHS | Compliant per EU 2015/863 |
| Prop65 | Compliant per California Proposition 65 |
| Low-Halogen Status | Not Low-Halogen per IEC 61249-2-21 |
| REACH SVHC | Not Contained per D(2025)7771-DC (04 Feb 2026) |
电气特性5 项
| dataRate | 28.0 Gbps |
| voltageMaximum | 30V AC (RMS)/DC |
| currentMaximumPerContact | 0.5A |
| shieldType | EMI Fingers |
| shielded | Yes |
认证1 项
| UL | E29179 |
物理特性27 项
| pcbRetention | Yes |
| platingMinMating | 0.762µm |
| circuitsLoaded | 40 |
| lockToMatingPart | Yes |
| platingMinTermination | 0.762µm |
| durabilityMatingCyclesMax | 100 |
| panelMount | No |
| pcbLocator | Yes |
| ports | 2 |
| polarizedToMatingPart | Yes |
| netWeight | 27.249/g |
| orientation | Right Angle |
| gender | Female |
| materialPlatingMating | Gold |
| materialResin | High Temperature Thermoplastic |
| materialMetal | High Performance Alloy (HPA) |
| pcbThicknessRecommended | 1.57mm |
| pitchMatingInterface | 0.80mm |
| flammability | 94V-0 |
| colorResin | Black |
| polarizedToPcb | Yes |
| packagingType | Tray |
| pitchTerminationInterface | 0.80mm |
| temperatureRangeOperating | -40° to +85°C |
| numberOfRows | 2 |
| terminationInterfaceStyle | Through Hole - Compliant Pin |
| materialPlatingTermination | Matte Tin |
物料主数据23 项
| materialType | FERT |
| productDescription | zSFP+ Stacked, 2x1 w/metal and w/LP |
| productManagerGlobal | Vivek Menon |
| productStatus | Active |
| productLine | 03 |
| productNumberHyphen | 171224-1013 |
| samples | False |
| labOffice | DSS |
| productNumberSap | 1712241013 |
| division | 50 |
| flaggedForDeletion | No |
| productManagerGlobalCode | 2BL |
| salesOrgText | 3100:"""Tariff Impacted"" " |
| labOfficeName | DataCom and Specialty |
| engineeringNumber | 171224-1013 |
| productFamilyCode | F1 |
| productNumberDisplay | 1712241013 |
| promotable | True |
| materialCreateDate | 2012-02-15 |
| countryOfOrigin | CN,ID,SG |
| salesStatusDescription | Promotable, New Rel |
| divisionText | DataCom & Specialty |
| salesStatusCode | AF |
一般信息9 项
| taxonomyPathValues | Products>Connectors>High-Speed I/O Products>High-Speed I/O Connectors |
| taxonomyPathIds | products>connectors>high-speed-io-products>high-speed-io-connectors |
| componentType | Receptacle |
| type | Pluggable |
| upc | 884982961371 |
| webDescription | zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-1 with Outer Down/Up Light Pipes, 40 Circuits |
| isPublished | True |
| productName | zSFP Plus,zSFP+ |
| application | Module-to-Board |
来源：原厂官网规格库（经 ERP 同步）