型号目录
共 285379 个料号 · 第 1047 / 4757 页 · 库存同步 2026-11-15 08:54

15800109
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

15800123
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15800129
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800149
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800169
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800189
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800209
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800229
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800249
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800269
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800289
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800309
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15800329
2.54mm Pitch C-Grid Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
