
15916089
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, Tin (Sn) Plating, Embossed Tape Packaging
共 284993 个料号 · 第 1057 / 4750 页(已筛选) · 库存同步 2026-11-16 07:49

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

C-Grid Breakaway PCB Header, 2.54mm Pitch, Surface Mount, Dual Row, Vertical, 10 Circuits, 0.38μm Gold (Au) Plating, 6.10mm Mating Pin Length, Tape and Reel, with Cap

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 10 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 11 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

C-Grid Breakaway PCB Header, 2.54mm Pitch, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.75μm Gold (Au) Plating, 6.10mm Mating Pin Length, Tape and Reel, with Cap

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 13 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

C-Grid Breakaway PCB Header, 2.54mm Pitch, Surface Mount, Dual Row, Vertical, 14 Circuits, 0.38μm Gold (Au) Plating, 6.10mm Mating Pin Length, Tape and Reel, with Cap

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 14 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

C-Grid Breakaway PCB Header, 2.54mm Pitch, Surface Mount, Dual Row, Vertical, 16 Circuits, Tin (Sn) Plating, Tape and Reel, with Cap

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 17 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 18 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 20 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 21 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 22 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 23 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 24 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, Tin (Sn) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 5 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 5 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 7 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging

2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging