共 285379 个料号 · 第 1064 / 4757 页 · 库存同步 2026-11-15 11:21
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 21 Circuits, Tin (Sn) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 22 Circuits, Tin (Sn) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 23 Circuits, Tin (Sn) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 24 Circuits, Tin (Sn) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, Tin (Sn) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 2 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 5 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 5 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 7 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 10 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 10 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 11 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 13 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 13 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 14 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 17 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 18 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, 0.75μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 20 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 21 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 22 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 23 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 24 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 25 Circuits, 0.38μm Gold (Au) Plating, Embossed Tape Packaging
1.27mm Pitch EBBI 50D Receptacle, Vertical, 50 Circuits, 3.40mm PC Tail Length
0.50mm Pitch Premo-Flex LVDS Jumper, 51.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 30 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 51.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 40 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 51.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 50 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 102.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 30 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 102.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 40 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 102.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 50 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 152.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 30 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 152.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 40 Circuits
0.50mm Pitch Premo-Flex LVDS Jumper, 152.00mm Cable Length, Gold (Au) Plating, 90±10 Ohms Differential Impedance, 50 Circuits
