共 282857 个料号 · 第 152 / 7072 页（已筛选） · 库存同步 2026-11-05 17:03
18 Position, Receptacle, Housing, Crimp, Wire-to-Board, 2.5 mm [.098 in] Centerline, 1 Row, Wire & Cable, Power & Signal, Economy Power 2.5
19 Position, Receptacle, Housing, Crimp, Wire-to-Board, 2.5 mm [.098 in] Centerline, 1 Row, Wire & Cable, Power & Signal, Economy Power 2.5
PCB Mount Header, Vertical, 10 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 11 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 12 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 13 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 14 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 15 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 16 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 17 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 18 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 19 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 10 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 11 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 12 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 13 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 14 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 15 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 16 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 17 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
PCB Mount Header, Vertical, 18 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Economy Power 2.5
OSFP, Cage Assembly, Operating Temperature Range -55 – 85 °C [-67 – 185 °F], 240 Position, 4 Ports, Port Matrix Configuration 1 x 4
OSFP, Cage Assembly, Operating Temperature Range -55 – 85 °C [-67 – 185 °F], 240 Position, 4 Ports, Port Matrix Configuration 1 x 4
QSFP-DD Heat Sink, Unidirectional, 24 Fin
56 POSITION SLIVER ORTHOGONAL EDSFF 1*1
Board-to-Board / Wire-to-Board, Shielded, Horizontal, 12 Position, Board Mount, A Code, 1.8 mm [.07 in] Centerline, Signal, Data Connectivity Headers
Board-to-Board / Wire-to-Board, Shielded, Horizontal, 12 Position, Board Mount, B Code, 1.8 mm [.07 in] Centerline, Signal, Data Connectivity Headers
Board-to-Board / Wire-to-Board, Shielded, Horizontal, 12 Position, Board Mount, C Code, 1.8 mm [.07 in] Centerline, Signal, Data Connectivity Headers
Board-to-Board / Wire-to-Board, Shielded, Horizontal, 12 Position, Board Mount, J Code, 1.8 mm [.07 in] Centerline, Signal, Data Connectivity Headers
Board-to-Board / Wire-to-Board, Shielded, Horizontal, 12 Position, Board Mount, Z Code, 1.8 mm [.07 in] Centerline, Signal, Data Connectivity Headers
zSFP+ Stacked (SFP56), Cage Assembly with Integrated Connector, .6mm [.018in] Centerline, Signal
zSFP+ Stacked (SFP56), Cage Assembly with Integrated Connector, .6mm [.018in] Centerline, Signal
Sliver for SFF-TA-1002, PCB Edge Card, Straddle Mount, 168 Position, Surface Mount, Sliver for SFF-TA-1002, Internal I/O Connectors
Sliver for SFF-TA-1002, PCB Edge Card, Straddle Mount, 140 Position, Surface Mount, Sliver for SFF-TA-1002, Internal I/O Connectors
连接器1-2340446-1受限产品
PCB Mount Header, Vertical, 10 Position, 2 mm [.079 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Dynamic 1000 Series
10 Position, Header, Wire-to-Board, 3.5 mm [.138 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder
13 Position, Header, Wire-to-Board, 3.5 mm [.138 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder
14 Position, Header, Wire-to-Board, 3.5 mm [.138 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder
15 Position, Header, Wire-to-Board, 3.5 mm [.138 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder
