
1-2342079-7
17 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder
共 285379 个料号 · 第 326 / 14269 页 · 库存同步 2026-11-10 08:58

17 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder

13 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

14 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

15 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

16 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

17 Position, Header, Wire-to-Board, 5 mm [.197 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

13 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder

14 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder

15 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder

16 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder

17 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Right Angle, Through Hole - Solder

13 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

14 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

15 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

16 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

17 Position, Header, Wire-to-Board, 5.08 mm [.2 in] Centerline, 1 Row, 300 VAC, Printed Circuit Board, Vertical, Through Hole - Solder, Power & Signal

QSFP-DD, Signal, Operating Temperature Range -55 – 65 °C [-67 – 149 °F], Data Rate (Max) 400 Gb/s, 1 Ports, Port Matrix Configuration 1 x 1

QSFP-DD, Signal, Operating Temperature Range -55 – 65 °C [-67 – 149 °F], Data Rate (Max) 400 Gb/s, 1 Ports, Port Matrix Configuration 1 x 1

QSFP-DD, Signal, Operating Temperature Range -55 – 65 °C [-67 – 149 °F], Data Rate (Max) 400 Gb/s, 1 Ports, Port Matrix Configuration 1 x 1

QSFP-DD, Signal, Operating Temperature Range -55 – 65 °C [-67 – 149 °F], Data Rate (Max) 400 Gb/s, 1 Ports, Port Matrix Configuration 1 x 1