
1-86177-3
12 Position, Receptacle, Housing, Crimp, Wire-to-Board, UL 94V-0, 2.54 mm [.1 in] Centerline, 2 Row, 250 VAC, Wire & Cable, Signal, AMPMODU IV/V
共 285380 个料号 · 第 538 / 14269 页 · 库存同步 2026-11-12 01:00

12 Position, Receptacle, Housing, Crimp, Wire-to-Board, UL 94V-0, 2.54 mm [.1 in] Centerline, 2 Row, 250 VAC, Wire & Cable, Signal, AMPMODU IV/V

Gold (Au), Pin Contact, Brass, -65 – 105 °C [-85 – 221 °F], AMPMODU MOD 1

1 Position, Lead Assembly, 10000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, LGH SGL

1 Position, Lead Assembly, 10000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, LGH SGL

1 Position, Lead Assembly, 15000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, Package

Lead Assembly, 20000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Receptacle, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, Package

Lead Assembly, 20000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Receptacle, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, Package

Lead Assembly, 20000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Receptacle, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, Package

Lead Assembly, 20000 VDC, 16 AWG, Wire-to-Wire, Wire & Cable, Receptacle, Socket, -55 – 125 °C [-67 – 257 °F], Pre-Terminated to Cable, Package

PCB Mount Header, Right Angle, Perpendicular, 26 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Gold (Au), Through Hole - Solder, AMPMODU Headers

PCB Mount Header, Right Angle, Perpendicular, 2 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Gold (Au), Through Hole - Solder, AMPMODU Headers

PCB Mount Header, Right Angle, Perpendicular, 4 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Gold (Au), Through Hole - Solder, AMPMODU Headers

PCB Mount Header, Right Angle, Perpendicular, 6 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Gold (Au), Through Hole - Solder, AMPMODU Headers

PCB Mount Header, Right Angle, Perpendicular, 8 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Gold (Au), Through Hole - Solder, AMPMODU Headers

PCB Mount Header, Right Angle, Perpendicular, 22 Position, 2.54 mm [.1 in] Centerline, Unshrouded, Gold (Au), Through Hole - Solder, AMPMODU Headers

Tin-Lead, Pin Contact, 26 – 22 AWG, .12 – .4 mm2 Wire, Discrete Wire, Insulation Displacement (IDC), Phosphor Bronze, Signal

Tin (Sn), Pin Contact, 26 – 22 AWG, .12 – .4 mm2 Wire, Discrete Wire, Insulation Displacement (IDC), Phosphor Bronze, Signal

Tin (Sn), Pin Contact, 26 – 22 AWG, .12 – .4 mm2 Wire, Discrete Wire, Insulation Displacement (IDC), Phosphor Bronze, Signal

Gold (Au), Socket Contact, 26 – 22 AWG, .12 – .4 mm2 Wire, Discrete Wire, Crimp, Phosphor Bronze, Signal, -65 – 105 °C [-85 – 221 °F]

8 Position, Receptacle, Housing, Crimp, Wire-to-Board, UL 94V-0, 2.54 mm [.1 in] Centerline, 2 Row, 250 VAC, Wire & Cable, AMPMODU LOCKING CLIP